描述
产品简要说明
ASML 859-8739-001 PCB是ASML光刻机（如EUV系列）的核心控制电路板，专为极端环境下的高精度信号传输设计。其核心功能包括：
多层信号整合：支持16层以上高密度互连（HDI）结构，实现亚微米级线宽控制。
抗干扰设计：集成磁屏蔽层与差分信号传输技术，EMC等级达IEC 61000-6-4。
极端环境适配：耐受-40℃至125℃温度波动，湿度范围5%-95%（无冷凝）。
产品详细说明
1.技术架构与创新
材料体系：
基材：采用聚酰亚胺（PI）与玻璃纤维复合材料，介电常数稳定在3.5±0.1。
导电层：99.99%纯度铜箔，表面粗糙度Ra≤0.8μm，确保高频信号完整性。
制造工艺：
激光钻孔：微盲孔直径≤50μm，孔壁粗糙度Ra≤1.5μm。
阻焊膜：采用液态光致阻焊剂（LPI），附着力≥2.0N/cm（划格法测试）。
2.工艺适配性
光刻机控制场景：
运动控制：支持纳米级步进台定位信号传输（延迟<10ns）。
能量管理：集成高精度电源分配网络（PDN），纹波抑制比>60dB。
环境适应性：
振动抑制：采用压电陶瓷主动减震技术，10-1000Hz频段振动衰减>30dB。
洁净度控制：表面颗粒污染≤0.1μm（Class 100洁净室标准）。
3.行业标准遵循
环保与安全：
ISO 14001：生产废水处理达标率100%，废气净化效率≥99.5%。
UL 94 V-0：阻燃等级符合最高安全标准，燃烧速率≤40mm/min。
制造规范：
IPC-600J：焊盘缺陷控制（中心80%区域无铜瘤/针孔），阻焊膜偏移≤±50μm。
IPC-6012D：线宽/间距公差±10%，孔环尺寸公差±15μm。
技术规格:ASML 859-8739-001
参数项规格描述
层数16层HDI
线宽/间距3/3μm（最小值）
工作温度-40℃至125℃
尺寸300mm×200mm×3.2mm
核心价值与性能亮点
1.极端环境可靠性
热管理：内置热电偶阵列实时监测，温度梯度控制≤0.5℃/cm²。
化学稳定性：耐受光刻胶残留物（如SU-8）腐蚀，表面电阻率≥1×10^12Ω。
2.信号完整性保障
阻抗控制：差分线阻抗50±2Ω，单端线阻抗100±5Ω。
抗串扰设计：相邻信号线耦合系数<5%，时序偏差
Product brief description
ASML 859-8739-001 PCB is the core control circuit board of ASML lithography machines(such as the EUV series),designed for high-precision signal transmission in extreme environments.Its core functions include:
Multi-layer signal integration:supports high-density interconnection(HDI)structures above 16 layers to realize submicron-level linewidth control.
Anti-interference design:integrated magnetic shielding layer and differential signal transmission technology,with an EMC level of IEC 61000-6-4.
Extreme environmental adaptation:Tolerate temperature fluctuations between-40℃and 125℃,humidity range of 5%-95%(no condensation).
Product details
1.Technical Architecture and Innovation
Material system:
Base material:Polyimide(PI)and glass fiber composite material are used,and the dielectric constant is stable at 3.5±0.1.
Conductive layer:99.99%purity copper foil,surface roughness Ra≤0.8μm,ensuring high-frequency signal integrity.
Manufacturing process:
Laser drilling:the diameter of the microblind hole is≤50μm,and the hole wall roughness Ra≤1.5μm.
Solder resist film:Liquid photoresist(LPI)is used,with adhesion≥2.0N/cm(scribing test).
2.Process adaptability
Lithography machine control scenario:
Motion control:Supports nano-level stepping stage positioning signal transmission(delay<10ns).
Energy management:Integrated high-precision power distribution network(PDN),ripple suppression ratio>60dB.
Environmental adaptability:
Vibration suppression:Use piezoelectric ceramic active shock absorption technology,and the vibration attenuation of the 10-1000Hz frequency band is>30dB.
Cleanliness control:Surface particle pollution≤0.1μm(Class 100 clean room standard).
3.Industry standards comply with
Environmental protection and safety:
ISO 14001:The production wastewater treatment compliance rate is 100%,and the waste gas purification efficiency is≥99.5%.
UL 94 V-0:The flame retardant grade meets the highest safety standards,and the combustion rate is≤40mm/min.
Manufacturing specifications:
IPC-600J:pad defect control(no copper tumor/pinhole in 80%of the center),solder resist film offset≤±50μm.
IPC-6012D:Line width/pad tolerance±10%,hole ring size tolerance±15μm.
Technical Specifications:ASML 859-8739-001
Parameters Specification Description
Number of layers 16 layers HDI
Line width/pitch 3/3μm(minimum)
Operating temperature-40℃to 125℃
Dimensions 300mm×200mm×3.2mm
Core Valuesand Performance Highlights
1.Extreme environmental reliability
Thermal management:built-in thermocouple array is monitored in real time,and the temperature gradient control is≤0.5℃/cm².
Chemical stability:Tolerate corrosion of photoresist residues(such as SU-8),surface resistivity≥1×10^12Ω.
2.Signal integrity guarantee
Impedance control:differential line impedance is 50±2Ω,single-ended line impedance is 100±5Ω.
Anti-crosstalk design:the coupling coefficient of adjacent signal lines is<5%,timing deviation is<1ps.
