3D80-000195-777296

-频率稳定度:±25ppm(-40°C至+85°C工作温度范围)。

封装设计:

-尺寸:5.0mm×3.2mm×1.0mm SMD封装(与行业主流型号兼容)。

2.关键技术参数

项目典型规格(参考同类产品)

电气特性

-输出波形:CMOS/TTL兼容;

-供电电压:3.3V±10%(低功耗设计);

环境适应性

-工作温度:-40°C至+85°C(工业级);

-存储温度:-55°C至+125°C;

可靠性

-震动测试:符合MIL-STD-883标准;

描述

1.产品定位与核心特性

3D80-000195-777296推测为高性能表面贴装晶体振荡器,定位严苛环境下的高精度时钟生成,聚焦低相位噪声、宽温稳定性与小型化设计。其核心特性包括:

频率精度:

-标称频率:推测为30.000MHz(参考同类产品命名规则);

-频率稳定度:±25ppm(-40°C至+85°C工作温度范围)。

封装设计:

-尺寸:5.0mm×3.2mm×1.0mm SMD封装(与行业主流型号兼容)。

2.关键技术参数

项目典型规格(参考同类产品)

电气特性

-输出波形:CMOS/TTL兼容;

-供电电压:3.3V±10%(低功耗设计);

环境适应性

-工作温度:-40°C至+85°C(工业级);

-存储温度:-55°C至+125°C;

可靠性

-震动测试:符合MIL-STD-883标准;

-长期稳定性:老化率<±1ppm/年;

3.功能优势

抗干扰设计:

-金属封装屏蔽:抑制电磁辐射(适用于高噪声工业环境);

-优化晶片切割工艺:降低谐波失真。

兼容性扩展:

-可编程输出:支持SPI接口配置(频率微调范围±100ppm);

-多负载适配:15pF/20pF电容可选(通过引脚跳线设置)。

4.典型应用场景

通信设备:

-5G基站同步时钟(满足ITU-T G.8272.1标准);

-光模块数据传输(抑制抖动<0.1UI)。

工业控制:

-PLC高速计数模块(抗振动干扰);

-伺服驱动器位置反馈(相位噪声<-120dBc/Hz 1kHz偏移)。

汽车电子:

-ADAS传感器时钟同步(AEC-Q100 Grade 0认证)。

1.Product positioning and core characteristics

3D80-000195-777296 It is speculated that it is a high-performance surface-mount crystal oscillator,positioning high-precision clock generation in harsh environments,focusing on low-phase noise,wide-temperature stability and miniaturized design.Its core features include:

Frequency accuracy:

-Nominal frequency:30.000MHz(refer to the naming rules of similar products);

-Frequency stability:±25ppm(-40°C to+85°C operating temperature range).

Package design:

-Size:5.0mm×3.2mm×1.0mm SMD package(compatible with mainstream models in the industry).

2.Key technical parameters

Project Typical specifications(refer to similar products)

Electrical characteristics

-Output waveform:CMOS/TTL compatible;

-Supply voltage:3.3V±10%(low power design);

Environmental adaptability

-Operating temperature:-40°C to+85°C(industrial grade);

-Storage temperature:-55°C to+125°C;

Reliability

-Vibration test:complies with MIL-STD-883 standard;

-Long-term stability:aging rate<±1ppm/year;

3.Functional Advantages

Anti-interference design:

-Metal packaging shielding:suppress electromagnetic radiation(suitable for high noise industrial environments);

-Optimize wafer cutting process:reduce harmonic distortion.

Compatibility Extensions:

-Programmable output:Supports SPI interface configuration(frequency fine-tuning range±100ppm);

-Multi-load adaptation:15pF/20pF capacitor is optional(set through pin jumper).

4.Typical application scenarios

Communication equipment:

-5G base station synchronization clock(meets ITU-T G.8272.1 standard);

-Optical module data transmission(suppress jitter<0.1UI).

Industrial Control:

-PLC high-speed counting module(anti-vibration interference);

-Servo drive position feedback(phase noise<-120dBc/Hz 1kHz offset).

Automotive Electronics:

-ADAS sensor clock synchronization(AEC-Q100 Grade 0 certification).