描述
1.红外探测功能
探测器类型:
非制冷微测辐射热计(Microbolometer),采用氧化钒(VOx)或多晶硅(a-Si)材料,对红外辐射敏感。
分辨率:
基础型号:384×288像素(NETD≤50mK 25℃)。
高配型号:640×512像素(NETD≤40mK 25℃,需确认是否属于AI3281系列)。
像元间距:
12μm(主流配置),提升空间分辨率与探测距离(如384×288 12μm可探测300m外人体目标)。
帧率:
9Hz/30Hz/60Hz可选(默认9Hz满足工业测温需求,30Hz适用于动态监控)。
测温范围:
标准型:-20℃~+150℃(适用于建筑检测、人体测温)。
工业型:-20℃~+650℃(支持高温工业设备监测)。
高温型:需选配红外滤镜,可扩展至1500℃(如冶金行业)。
2.图像处理功能
非均匀性校正(NUC):
自动或手动触发校正,消除探测器各像元响应差异,提升图像均匀性。
温度校正:
支持两点校正或多项式校正,根据环境温度动态调整测温精度。
图像增强:
直方图均衡化(HE):提升低对比度区域可见性。
动态范围压缩(DRC):适应不同场景亮度变化。
伪彩色映射:将温度值映射为铁红、彩虹、高对比度等伪彩色,便于人眼识别。
3.通信与控制接口
USB 2.0:
数据传输:支持YUV/RGB格式热图像或原始温度数据输出,兼容PC软件(如iRaytek SDK)。
电源供电:通过USB直接供电(5V/500mA),简化布线。
LVDS(低压差分信号):
高速传输:适合嵌入式系统(如ARM开发板),传输384×288图像无延迟。
低功耗:相比USB,LVDS更适合电池供电设备。
MIPI(移动行业处理器接口):
手机/平板集成:支持与高通、海思等SoC直接对接,用于智能手机红外测温附加镜头。
以太网(RJ45):
远程监控:通过TCP/IP协议传输图像数据,支持多客户端同时访问(如安防监控中心)。
4.硬件规格
尺寸:
模组尺寸:45mm×45mm×30mm(长×宽×高,含镜头),小巧轻便,便于集成。
重量:
<50g(不含镜头),适合无人机、机器人等轻量化平台。
工作温度:
-20℃~+70℃(工业级设计),适应恶劣环境。
防护等级:
IP67(可选),防尘防水,适合户外使用。
1.Infrared detection function
Detector type:
The non-refrigeration microbolometer uses vanadium oxide(VOx)or polysilicon(a-Si)materials,which are sensitive to infrared radiation.
Resolution:
Basic model:384×288 pixels(NETD≤50mK 25℃).
High-end model:640×512 pixels(NETD≤40mK 25℃,please confirm whether it belongs to the AI3281 series).
Cell spacing:
12μm(mainstream configuration),improve spatial resolution and detection distance(for example,384×288 12μm can detect human targets outside 300m).
Frame rate:
9Hz/30Hz/60Hz optional(default 9Hz meets industrial temperature measurement requirements,30Hz is suitable for dynamic monitoring).
Temperature measurement range:
Standard type:-20℃~+150℃(suitable for building inspection and human temperature measurement).
Industrial type:-20℃~+650℃(supports high-temperature industrial equipment monitoring).
High temperature type:Requires an infrared filter,which can be expanded to 1500℃(such as metallurgy industry).
2.Image processing function
Inhomogeneity correction(NUC):
Automatically or manually trigger corrections to eliminate the response differences between the detector cells and improve image uniformity.
Temperature correction:
Supports two-point correction or polynomial correction,and dynamically adjusts the temperature measurement accuracy according to the ambient temperature.
Image enhancement:
Histogram equalization(HE):Improves visibility of low-contrast areas.
Dynamic Range Compression(DRC):Adapt to changes in brightness in different scenarios.
Pseudo-color mapping:Map temperature values into pseudo-colors such as iron red,rainbow,and high contrast,for easy recognition by human eyes.
3.Communication and control interface
USB 2.0:
Data transmission:Supports YUV/RGB format thermal image or raw temperature data output,compatible with PC software(such as iRaytek SDK).
Power supply:Direct power supply via USB(5V/500mA)to simplify wiring.
LVDS(Low Voltage Differential Signal):
High-speed transmission:Suitable for embedded systems(such as ARM development boards),transmitting 384×288 images without delay.
Low Power Consumption:LVDS is better suited for battery-powered devices than USB.
MIPI(Mobile Industry Processor Interface):
Mobile phone/tablet integration:supports direct docking with SoCs such as Qualcomm and HiSilicon,and is used for additional lenses for infrared temperature measurement of smartphones.
Ethernet(RJ45):
Remote monitoring:Transfer image data through TCP/IP protocol,supporting simultaneous access by multiple clients(such as security monitoring center).
4.Hardware specifications
size:
Module size:45mm×45mm×30mm(length×width×height,including lens),small and lightweight,easy to integrate.
weight:
<50g(without lens),suitable for lightweight platforms such as drones and robots.
Operating temperature:
-20℃~+70℃(industrial design),adapting to harsh environments.
Protection level:
IP67(optional),dust-proof and water-resistant,suitable for outdoor use.
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