描述
物理特性
-材质:不锈钢(SS316L)、铝合金或陶瓷(半导体设备常见耐腐蚀材料);
-尺寸:AMAT同类组件通常为定制化设计(如φ50–150 mm法兰或模块化结构);
-接口:兼容KF/ISO法兰或卡套式连接(真空系统常见标准)。
性能参数
-压力范围:10^-7 to 760 Torr(超高真空至大气压适用);
-温度耐受:-40°C至+200°C(部分工艺模块支持更高温度);
-兼容气体:惰性气体(Ar、N₂)、工艺气体(SiH₄、Cl₂)或腐蚀性介质(需防腐设计)。
电气/控制
-供电需求:24 V DC(传感器或执行器常见);
-信号输出:4–20 mA或数字信号(如RS-485)。
三、应用场景与兼容性
设备适配:可能用于AMAT Centura、Endura或Producer系列平台;
工艺关联:CMP设备中的抛光头组件,或刻蚀机中的气体分流器;
维护特性:支持热插拔或模块化更换(减少设备停机时间)。
Physical characteristics
-Material:stainless steel(SS316L),aluminum alloy or ceramic(common corrosion-resistant materials for semiconductor equipment);
-Dimensions:AMAT similar components are usually customized(such asφ50–150 mm flanges or modular structures);
-Interface:Compatible with KF/ISO flange or tuck type connection(common standard for vacuum systems).
Performance parameters
-Pressure range:10^-7 to 760 Torr(sufficient for ultra-high vacuum to atmospheric pressure);
-Temperature tolerance:-40°C to+200°C(some process modules support higher temperatures);
-Compatible gases:inert gas(Ar,N₂),process gas(SiH₄,Cl₂)or corrosive media(requires anti-corrosion design).
Electrical/Control
-Power supply requirements:24 V DC(common sensor or actuator);
-Signal output:4–20 mA or digital signal(such as RS-485).
3.Application scenarios and compatibility
Device adaptation:May be used for AMAT Centura,Endura or Producer series platforms;
Process association:polishing head assembly in CMP equipment,or gas shunt in etching machine;
Maintenance features:Supports hot swap or modular replacement(reduces equipment downtime).
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