ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358

真空封装设计,内部气压<1e-4 mbar,减少空气折射率波动影响。

铝合金框架与钛合金散热片,热膨胀系数(CTE)匹配光刻机基座(1.3ppm/℃)。

2.性能突破

动态响应能力:

支持2000线/秒的晶圆扫描速度,图像采集延迟<2ms。

抗干扰能力:

屏蔽层采用铜-镍复合结构,电磁屏蔽效能达80dB(1MHz~1GHz)。

能效优化:

动态功耗管理技术,待机功耗≤3W,运行功耗≤20W。

技术规格:ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358

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描述

产品简要说明

ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358是ASML专为光刻机设计的高分辨率实时检测摄像头,核心特性包括:

亚微米级成像精度:采用CMOS全局快门传感器,单像素尺寸≤0.8μm,分辨率≥8K(7680×4320)。

实时缺陷检测:支持120Hz帧率,结合AI算法实现晶圆表面缺陷的毫秒级识别。

洁净室级防护:通过Class 1洁净室认证,气密性等级IP68,抗静电等级ESD 15kV。

产品详细说明

1.技术架构与核心功能

光学成像系统:

镜头组采用非球面透镜与偏振滤光片组合,消除光刻机激光的杂散光干扰。

集成LED照明模块(波长405nm/450nm可切换),支持明场/暗场双模式成像。

传感器与处理单元:

全局快门CMOS传感器(索尼IMX500系列),量子效率≥85%(405nm波长)。

FPGA实时图像预处理,支持噪声抑制、边缘增强与缺陷特征提取。

环境适应性:

真空封装设计,内部气压<1e-4 mbar,减少空气折射率波动影响。

铝合金框架与钛合金散热片,热膨胀系数(CTE)匹配光刻机基座(1.3ppm/℃)。

2.性能突破

动态响应能力:

支持2000线/秒的晶圆扫描速度,图像采集延迟<2ms。

抗干扰能力:

屏蔽层采用铜-镍复合结构,电磁屏蔽效能达80dB(1MHz~1GHz)。

能效优化:

动态功耗管理技术,待机功耗≤3W,运行功耗≤20W。

技术规格:ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358

参数项规格描述

分辨率7680×4320像素

帧率120Hz(全分辨率模式)

量子效率≥85% 405nm

工作温度20℃±0.3℃(恒温控制)

真空环境内部气压<1e-4 mbar

接口类型Camera Link HS Gen2(带宽≥10Gbps)

功耗≤20W(运行模式)

核心价值与性能亮点

1.极端环境适应性

真空环境稳定性:采用无油润滑机械结构,避免污染光学元件。

低温恒温设计:内置热电制冷模块,温度波动≤0.03℃,确保传感器热噪声<5e-6 DN。

2.多场景扩展性

跨代兼容性:适配ASML NXE 3800E及后续High-NA EUV光刻机。

工业互联网集成:支持OPC UA协议,可与光刻机控制系统实时同步检测结果。

3.全生命周期成本优化

自清洁功能:内置紫外杀菌模块,减少镜头污染维护频率。

模块化更换:传感器与镜头组件可独立更换,维修成本降低40%。

Product brief description

ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358 is a high-resolution real-time detection camera designed by ASML for lithography machines.The core features include:

Submicron-level imaging accuracy:CMOS global shutter sensor is used,with a single pixel size of≤0.8μm and a resolution of≥8K(7680×4320).

Real-time defect detection:supports 120Hz frame rate,and combines AI algorithm to achieve millisecond recognition of wafer surface defects.

Clean room-level protection:passed Class 1 clean room certification,airtightness level IP68,antistatic level ESD 15kV.

Product details

1.Technical architecture and core functions

Optical imaging system:

The lens group uses an aspherical lens and a polarization filter to eliminate stray light interference from the photolithography machine laser.

Integrated LED lighting module(wavelength 405nm/450nm can be switched)supports bright field/dark field dual-mode imaging.

Sensor and processing unit:

Global shutter CMOS sensor(Sony IMX500 series),quantum efficiency≥85%(405nm wavelength).

FPGA real-time image preprocessing supports noise suppression,edge enhancement and defect feature extraction.

Environmental adaptability:

Vacuum package design,internal air pressure<1e-4 mbar,reducing the influence of air refractive index fluctuations.

The aluminum alloy frame and titanium alloy heat sink,the thermal expansion coefficient(CTE)matches the base of the lithography machine(1.3ppm/℃).

2.Performance breakthrough

Dynamic response capability:

Supports wafer scanning speed of 2000 lines/second,and image acquisition delay is<2ms.

Anti-interference ability:

The shielding layer adopts a copper-nickel composite structure,and the electromagnetic shielding effect is 80dB(1MHz~1GHz).

Energy efficiency optimization:

Dynamic power consumption management technology,standby power consumption≤3W,and running power consumption≤20W.

Technical Specifications:ASML 2500 5000 PSCOPE CAMERA 4022.428.05233 22052358

Parameters Specification Description

Resolution 7680×4320 pixels

Frame rate 120Hz(full resolution mode)

Quantum efficiency≥85% 405nm

Working temperature:20℃±0.3℃(constant temperature control)

Vacuum environment Internal air pressure<1e-4 mbar

Interface type Camera Link HS Gen2(bandwidth≥10Gbps)

Power consumption≤20W(operating mode)

Core Values​​and Performance Highlights

1.Extreme environmental adaptability

Vacuum environment stability:oil-free lubricating mechanical structure is adopted to avoid contamination of optical components.

Low temperature constant temperature design:built-in thermoelectric refrigeration module,temperature fluctuation is≤0.03℃,ensuring sensor thermal noise is<5e-6 DN.

2.Multi-scene scalability

Cross-generation compatibility:adapted to ASML NXE 3800E and subsequent High-NA EUV lithography machines.

Industrial Internet integration:supports OPC UA protocol,and can synchronize the detection results in real time with the lithography machine control system.

3.Full life cycle cost optimization

Self-cleaning function:built-in UV sterilization module to reduce lens pollution maintenance frequency.

Modular replacement:The sensor and lens assembly can be replaced independently,reducing maintenance costs by 40%.