描述
产品简要说明
ASML 4022.430.2125是ASML专为工业控制与精密仪器设计的高密度背板PCB，核心特性包括：
多层互联架构：支持16层以上高密度互连（HDI），信号传输速率≥10Gbps。
极端环境适应性：耐受-40℃～+125℃温度范围，抗振动≥10g（5-500Hz）。
模块化设计：兼容PCIe、SATA、FPGA等多种接口协议，支持快速扩展。
产品详细说明
1.技术架构与核心功能
材料与工艺：
基材选择：采用聚酰亚胺（PI）或Rogers高频材料，介电常数（Dk）≤3.5，损耗因子（Df）≤0.0025。
微孔技术：激光钻孔直径≤60μm，孔壁粗糙度≤1μm，实现高密度布线。
信号完整性优化：
集成差分对设计，串扰抑制比（CIR）≥30dB，眼图余量≥20%。
电源层去耦电容密度≥200个/cm²，电压波动≤±1%。
散热与可靠性：
嵌入式铜管散热结构，热阻≤0.5℃/W。
通过MIL-STD-883H标准测试，湿热循环（85℃/85%RH）≥2000小时无失效。
2.性能突破
高频稳定性：
5GHz信号插入损耗≤2dB，相位误差≤5°。
抗电磁干扰：
辐射抗扰度（RS）≥10V/m（10kHz-1GHz），传导抗扰度（CS）≥4kV（1kHz-80MHz）。
长寿命设计：
焊接热循环（-40℃～+260℃）≥500次，金手指磨损率≤0.1μm/次。
技术规格:ASML 4022.430.2125
参数项规格描述
层数16层（可定制至32层）
基材类型Rogers RO4350B/PI复合材料
尺寸范围100mm×150mm～600mm×800mm（定制化生产）
工作温度-40℃～+125℃
核心价值与性能亮点
1.工业级可靠性
极端环境适应性：支持沙漠、极地等恶劣工况，通过盐雾测试（24小时，5%NaCl溶液）无腐蚀。
故障自诊断：集成BIST（内建自测试）电路，可实时监测信号完整性与电源稳定性。
2.高密度互联优势
空间节省：相比传统背板，体积减少40%，重量降低30%。
协议兼容性：支持PCIe 5.0、SATA 6Gbps、LVDS等接口，单板可集成≥128个连接器。
3.生态协同设计
ASML设备适配：专为ASML光刻机（如PAS 2500/5000系列）的运动控制、传感器模块设计，兼容其通信协议（XICB接口）。
跨行业扩展：可适配医疗影像设备（如CT机探测器）、航空航天导航系统等高可靠性场景。
Product brief description
ASML 4022.430.2125 is a high-density backplane PCB designed by ASML for industrial control and precision instruments.The core features include:
Multi-layer interconnection architecture:supports high-density interconnection(HDI)above 16 layers,and the signal transmission rate is≥10Gbps.
Extreme environmental adaptability:Tolerate temperature range of-40℃~+125℃,vibration resistance≥10g(5-500Hz).
Modular design:compatible with PCIe,SATA,FPGA and other interface protocols,and supports rapid expansion.
Product details
1.Technical architecture and core functions
Materials and Process:
Substrate selection:Use polyimide(PI)or Rogers high-frequency materials,with dielectric constant(Dk)≤3.5,and loss factor(Df)≤0.0025.
Micropore technology:laser drilling diameter is≤60μm,hole wall roughness is≤1μm,achieving high-density wiring.
Signal integrity optimization:
Integrated differential pair design,crosstalk suppression ratio(CIR)≥30dB,eye image margin≥20%.
The power layer decoupling capacitor density is≥200 pieces/cm²,and the voltage fluctuates≤±1%.
Heat dissipation and reliability:
Thermal resistance of embedded copper tube is≤0.5℃/W.
Passed the MIL-STD-883H standard test,there was no failure in humidity and heat cycle(85℃/85%RH)for≥2000 hours.
2.Performance breakthrough
High frequency stability:
The 5GHz signal insertion loss is≤2dB,and the phase error is≤5°.
Anti-electromagnetic interference:
Radiation immunity(RS)≥10V/m(10kHz-1GHz),conduction immunity(CS)≥4kV(1kHz-80MHz).
Long life design:
The welding thermal cycle(-40℃~+260℃)is≥500 times,and the wear rate of gold fingers is≤0.1μm/time.
Technical specifications:ASML 4022.430.2125
Parameters Specification Description
Number of layers:16 layers(customized to 32 layers)
Substrate Type Rogers RO4350B/PI Composite
Size range:100mm×150mm~600mm×800mm(customized production)
Working temperature-40℃～+125℃
Core Valuesand Performance Highlights
1.Industrial-grade reliability
Extreme environmental adaptability:Supports harsh working conditions such as deserts and polar regions,and passes salt spray test(24 hours,5%NaCl solution)without corrosion.
Fault self-diagnosis:Integrated BIST(built-in self-test)circuit,which can monitor signal integrity and power stability in real time.
2.Advantages of high-density interconnection
Space saving:Compared with traditional back panels,the volume is reduced by 40%and the weight is reduced by 30%.
Protocol compatibility:supports PCIe 5.0,SATA 6Gbps,LVDS and other interfaces,and the single board can integrate≥128 connectors.
3.Ecological collaborative design
ASML device adaptation:designed for motion control and sensor modules of ASML lithography machines(such as PAS 2500/5000 series),and compatible with its communication protocol(XICB interface).
Cross-industry expansion:It can be adapted to high-reliability scenarios such as medical imaging equipment(such as CT machine detectors),aerospace navigation systems,etc.
