描述
产品简要说明
ASML 4022 435 2439 40224352439是ASML专为光刻机设计的高精度光学检测模块，核心特性包括：
纳米级分辨率：采用CMOS全局快门传感器，单像素尺寸≤0.5μm，分辨率≥16K（15360×8640）。
实时动态校准：支持激光干涉仪联动校准，定位误差≤0.05μm。
洁净室级防护：通过Class 1洁净室认证，气密性等级IP69K，抗静电等级ESD 10kV。
产品详细说明
1.技术架构与核心功能
光学成像系统：
镜头组采用自由曲面透镜与偏振分光技术，消除光刻机激光的散射干扰。
集成可调谐激光光源（波长405nm/450nm/633nm），支持多光谱成像模式。
传感器与处理单元：
全局快门CMOS传感器（索尼IMX519系列），量子效率≥90%（405nm波长）。
自主研发FPGA芯片（ASML-FPGA 2025），支持实时图像降噪与边缘增强。
环境适应性：
真空封装设计，内部气压<1e-5 mbar，减少空气折射率波动影响。
钛合金框架与碳纤维复合散热片，热膨胀系数（CTE）匹配光刻机基座（0.8ppm/℃）。
2.性能突破
动态响应能力：
支持3000线/秒的晶圆扫描速度，图像采集延迟<1ms。
抗干扰能力：
屏蔽层采用铜-银纳米复合材料，电磁屏蔽效能达90dB（1MHz～1GHz）。
能效优化：
动态功耗管理技术，待机功耗≤2W，运行功耗≤15W。
技术规格:ASML 4022 435 2439 40224352439
参数项规格描述
分辨率15360×8640像素
帧率180Hz（全分辨率模式）
量子效率≥90% 405nm
工作温度20℃±0.2℃（恒温控制）
真空环境内部气压<1e-5 mbar
接口类型Camera Link HS Gen3（带宽≥20Gbps）
功耗≤15W（运行模式）
核心价值与性能亮点
1.极端环境适应性
真空环境稳定性：采用无油润滑磁悬浮轴承，避免污染光学元件。
低温恒温设计：内置激光冷却模块，温度波动≤0.02℃，确保传感器暗电流<2e-5 A。
2.多场景扩展性
跨代兼容性：适配ASML NXE 3800E及后续High-NA EUV光刻机。
工业互联网集成：支持MQTT协议，可与光刻机控制系统实时同步检测数据。
3.全生命周期成本优化
自清洁功能：内置等离子体清洗系统，减少镜头维护频率。
模块化更换：传感器与激光光源组件可独立更换，维修成本降低60%。
Product brief description
ASML 4022 435 2439 40224352439 is a high-precision optical detection module designed by ASML for lithography machines.The core features include:
Nano-level resolution:CMOS global shutter sensor is used,with a single pixel size of≤0.5μm and a resolution of≥16K(15360×8640).
Real-time dynamic calibration:supports laser interferometer linkage calibration,with positioning error≤0.05μm.
Clean room-level protection:passed Class 1 clean room certification,airtightness level IP69K,antistatic level ESD 10kV.
Product details
1.Technical architecture and core functions
Optical imaging system:
The lens group uses free curved lenses and polarization spectroscopy technology to eliminate scattering interference from the laser light of the lithography machine.
Integrated tunable laser light source(wavelength 405nm/450nm/633nm)supports multispectral imaging mode.
Sensor and processing unit:
Global shutter CMOS sensor(Sony IMX519 series),quantum efficiency≥90%(405nm wavelength).
Independently developed FPGA chip(ASML-FPGA 2025),supporting real-time image noise reduction and edge enhancement.
Environmental adaptability:
Vacuum package design,internal air pressure<1e-5 mbar,reducing the influence of air refractive index fluctuations.
Titanium alloy frame and carbon fiber composite heat sink,thermal expansion coefficient(CTE)matches the base of the lithography machine(0.8ppm/℃).
2.Performance breakthrough
Dynamic response capability:
Supports wafer scanning speed of 3000 lines/second,and image acquisition delay is<1ms.
Anti-interference ability:
The shielding layer is made of copper-silver nanocomposite material,and the electromagnetic shielding effect is 90dB(1MHz~1GHz).
Energy efficiency optimization:
Dynamic power consumption management technology,standby power consumption≤2W,and operating power consumption≤15W.
Technical specifications:ASML 4022 435 2439 40224352439
Parameters Specification Description
Resolution 15360×8640 pixels
Frame rate 180Hz(full resolution mode)
Quantum efficiency≥90% 405nm
Working temperature:20℃±0.2℃(constant temperature control)
Vacuum environment Internal air pressure<1e-5 mbar
Interface type Camera Link HS Gen3(bandwidth≥20Gbps)
Power consumption≤15W(operating mode)
Core Valuesand Performance Highlights
1.Extreme environmental adaptability
Vacuum environment stability:oil-free lubricated magnetic levitation bearings are used to avoid contamination of optical components.
Low temperature constant temperature design:built-in laser cooling module,temperature fluctuations≤0.02℃,ensuring the sensor dark current<2e-5 A.
2.Multi-scene scalability
Cross-generation compatibility:adapted to ASML NXE 3800E and subsequent High-NA EUV lithography machines.
Industrial Internet integration:supports MQTT protocol and can detect data in real time synchronously with the lithography machine control system.
3.Full life cycle cost optimization
Self-cleaning function:built-in plasma cleaning system to reduce lens maintenance frequency.
Modular replacement:The sensor and laser light source components can be replaced independently,reducing maintenance costs by 60%.
