描述
产品简要说明
ASML 4022.436.2250 6D是一款专为极紫外（EUV）光刻机设计的六自由度（6DOF）高精度运动控制平台，核心功能包括：
纳米级定位：X/Y/Z轴重复定位精度≤1nm，θX/θY/θZ轴角定位精度≤100nrad。
动态响应：加速度≥10m/s²，闭环带宽≥1kHz。
抗环境干扰：通过ASML内部ISO 14130振动标准，可承受20Hz-2kHz频段5g振动。
产品详细说明
1.技术架构与创新
多轴协同控制：
解耦设计：采用磁悬浮+压电复合驱动，消除轴间耦合误差（<0.1%）。
实时补偿算法：基于机器学习的热形变预测模型，温度漂移补偿效率≥95%。
光学集成适配：
反射镜定位：支持EUV光学模块（如ZEPHYR反射镜组）的±50μm行程微调。
光路校准接口：集成干涉仪反馈通道（波长632.8nm），校准误差<0.05nm。
2.核心功能模块
动态负载平衡：
自适应阻尼：根据载荷质量（10-50kg）自动调节阻尼系数，振动抑制比≥40dB。
热管理：液冷循环系统（温度控制精度±0.1℃），避免热膨胀导致的定位漂移。
故障自检系统：
多传感器融合：集成加速度计、陀螺仪、位移传感器，实时监测6DOF运动状态。
故障隔离机制：单轴失效时，剩余轴可切换至安全模式，保持系统稳定性。
3.行业应用适配性
EUV光刻机集成：
晶圆台控制：驱动ASML TWINSCAN NXE:3600D光刻机的晶圆台（直径300mm），曝光场对准误差≤0.3nm。
光学掩模校准：配合PHILIPS X射线检测系统，实现掩模缺陷定位精度≤5nm。
量子计算设备：
超导量子比特阵列控制：支持4K低温环境下的纳米级位移（ΔZ≤0.5nm）。
磁屏蔽兼容：铁磁材料含量<0.001%，避免对超导磁体产生干扰。
技术规格:ASML 4022.436.2250 6D
参数项规格描述
定位精度X/Y/Z轴≤1nm，θX/θY/θZ轴≤100nrad
行程范围X/Y轴±50mm，Z轴±20mm，θX/θY/θZ轴±100μrad
工作温度-40℃至125℃（基础模式），-40℃至85℃（液冷模式）
功率消耗≤200W（连续运行）
Product brief description
ASML 4022.436.2250 6D is a six-degree of freedom(6DOF)high-precision motion control platform designed for extreme ultraviolet(EUV)lithography machines.The core functions include:
Nano-level positioning:X/Y/Z axis repeat positioning accuracy≤1nm,θX/θY/θZ axis angular positioning accuracy≤100nrad.
Dynamic response:acceleration≥10m/s²,closed-loop bandwidth≥1kHz.
Anti-environmental interference:Through the ASML internal ISO 14130 vibration standard,it can withstand 5g vibrations in the 20Hz-2kHz frequency band.
Product details
1.Technical Architecture and Innovation
Multi-axis collaborative control:
Decoupling design:Magnetic levitation+piezoelectric composite driving is used to eliminate the coupling error between the shafts(<0.1%).
Real-time compensation algorithm:a thermal deformation prediction model based on machine learning,with temperature drift compensation efficiency≥95%.
Optical Integration Adaptation:
Mirror positioning:Supports fine adjustment of±50μm stroke of EUV optical modules(such as ZEPHYR mirror group).
Optical path calibration interface:integrated interferometer feedback channel(wavelength 632.8nm),calibration error<0.05nm.
2.Core functional modules
Dynamic load balancing:
Adaptive damping:The damping coefficient is automatically adjusted according to the load mass(10-50kg),and the vibration suppression ratio is≥40dB.
Thermal management:liquid-cooled circulation system(temperature control accuracy±0.1℃)to avoid positioning drift caused by thermal expansion.
Fault self-test system:
Multi-sensor fusion:Integrated accelerometer,gyroscope,displacement sensor to monitor 6DOF motion status in real time.
Fault isolation mechanism:When a single axis fails,the remaining axis can be switched to safe mode to maintain system stability.
3.Industry application adaptability
EUV lithography machine integration:
Wafer control:drives the wafer table(diameter 300mm)of ASML TWINSCAN NXE:3600D lithography machine,and the exposure field alignment error is≤0.3nm.
Optical mask calibration:In combination with PHILIPS X-ray detection system,mask defect positioning accuracy is≤5nm.
Quantum computing devices:
Superconducting qubit array control:supports nanoscale displacement(ΔZ≤0.5nm)in 4K low temperature environment.
Magnetic shielding compatibility:The ferromagnetic material content is<0.001%,avoiding interference with superconducting magnets.
Technical Specifications:ASML 4022.436.2250 6D
Parameters Specification Description
Positioning accuracy X/Y/Z axis≤1nm,θX/θY/θZ axis≤100nrad
Stroke range X/Y axis±50mm,Z axis±20mm,θX/θY/θZ axis±100μrad
Operating temperature-40℃to 125℃(basic mode),-40℃to 85℃(liquid cooling mode)
Power consumption≤200W(continuous operation)
