描述
产品简要说明
ASML 4022.436.6367是ASML光刻机的关键控制电路板，专为半导体制造的高精度工艺设计。其核心功能包括：
多层电路集成：支持复杂信号传输与逻辑控制，兼容ASML光刻机核心模块（如掩模台、晶圆台驱动系统）。
工业级可靠性：质保期1年，七天验收期，交货周期1-3个工作日，适用于严苛制造环境。
产品详细说明
1.技术架构与核心功能
多层电路设计：
基于玻璃纤维增强环氧树脂基板，覆盖多层铜箔导电轨迹，支持高密度元件集成（如SMT贴装的IC、电容、连接器）。
采用PTH（通孔）与盲孔/埋孔技术，实现层间信号高效连接。
工业控制适配：
兼容ASML光刻机的运动控制协议，支持微米级定位精度（参考同类产品技术指标）。
集成温度、振动传感器接口，实时反馈设备状态。
2.性能突破
环境适应性：
工作温度范围15-30℃，湿度20%-80%RH（非冷凝），抗电磁干扰等级EMI≥70dB（参考行业标准）。
能效优化：
低功耗设计，动态功耗波动≤5%（RMS）。
技术规格:ASML 4022.436.6367
参数项规格描述
基板材料玻璃纤维增强环氧树脂
层数多层
导电轨迹工艺铜箔蚀刻+电镀工艺
质保期1年
核心价值与性能亮点
1.高密度电路集成
复杂信号处理：支持光刻机核心模块（如激光源、光学校准系统）的高频信号传输与逻辑控制。
空间优化：多层结构减少物理尺寸，适配紧凑型光刻机设计。
2.工业级可靠性
严苛环境适配：通过ASML内部测试，满足半导体制造中连续运行需求。
快速交付保障：1-3个工作日交货，减少产线停机时间。
应对挑战，创造价值
1.高精度控制需求
技术突破：多层电路设计降低信号干扰，支持光刻机微米级定位精度。
应用案例：某28nm制程产线部署后，关键层曝光良率提升10%。
2.长期稳定性维护
技术突破：采用高耐腐蚀基板材料，MTBF（平均无故障时间）≥5000小时。
应用案例：某存储芯片厂商使用后，单机年维护成本降低20%。
Product brief description
ASML 4022.436.6367 is the key control circuit board for ASML lithography machines,designed for high-precision processes for semiconductor manufacturing.Its core functions include:
Multi-layer circuit integration:supports complex signal transmission and logic control,and is compatible with ASML lithography machine core modules(such as mask tables and wafer table driver systems).
Industrial-grade reliability:warranty period is 1 year,seven-day acceptance period,and delivery period is 1-3 working days,suitable for harsh manufacturing environments.
Product details
1.Technical architecture and core functions
Multi-layer circuit design:
Based on glass fiber reinforced epoxy resin substrate,it covers multi-layer copper foil conductive tracks and supports high-density component integration(such as SMT-mounted ICs,capacitors,connectors).
PTH(through hole)and blind hole/buried hole technology are used to achieve efficient connection between layers of signals.
Industrial control adaptation:
Compatible with the motion control protocol of ASML lithography machines,supports micron-level positioning accuracy(refer to the technical indicators of similar products).
Integrated temperature and vibration sensor interfaces,real-time feedback on the device status.
2.Performance breakthrough
Environmental adaptability:
Operating temperature range is 15-30℃,humidity is 20%-80%RH(non-condensing),and anti-electromagnetic interference grade EMI≥70dB(refer to industry standards).
Energy efficiency optimization:
Low power consumption design,dynamic power fluctuation≤5%(RMS).
Technical specifications:ASML 4022.436.6367
Parameters Specification Description
Substrate material Glass fiber reinforced epoxy resin
Number of layers Multiple layers
Conductive track process Copper foil etching+electroplating process
Warranty period 1 year
Core Valuesand Performance Highlights
1.High-density circuit integration
Complex signal processing:supports high-frequency signal transmission and logic control of lithography core modules(such as laser sources,optical calibration systems).
Space optimization:Multi-layer structure reduces physical size and is suitable for compact lithography machine design.
2.Industrial-grade reliability
Strict environmental adaptation:Passed internal ASML testing to meet the continuous operation needs in semiconductor manufacturing.
Fast delivery guarantee:1-3 working days delivery,reducing production line downtime.
Respond to challenges and create value
1.High-precision control requirements
Technical breakthrough:Multi-layer circuit design reduces signal interference and supports micron-level positioning accuracy of lithography machines.
Application case:After the deployment of a 28nm process production line,the exposure yield of key layers increased by 10%.
2.Long-term stability maintenance
Technical breakthrough:High corrosion-resistant substrate material is used,MTBF(average failure-free time)is≥5000 hours.
Application case:After a memory chip manufacturer uses it,the annual maintenance cost of a stand-alone machine is reduced by 20%.
