ASML 4022 456 10381

真空封装设计,内部气压<1e-6 mbar,减少气体散射干扰。

钛合金框架与碳化硅散热基板,热导率≥400W/(m·K)。

2.性能突破

光束稳定性:

长期漂移≤0.05μm/小时(24小时连续运行)。

抗干扰能力:

电磁屏蔽层采用氮化铝-铜复合结构,屏蔽效能≥100dB(1MHz~10GHz)。

能效优化:

光学转换效率≥85%,系统整体功耗≤500W。

技术规格:ASML 4022 456 10381

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描述

产品简要说明

ASML 4022 456 10381是ASML专为EUV光刻机设计的高精度激光调制模块,核心特性包括:

亚纳米级光斑控制:采用自适应光学整形技术,光斑直径≤0.3μm(13.5nm波长)。

动态功率调节:支持100W~500W连续可调,响应时间<500μs。

洁净室级可靠性:通过Class 0.1洁净室认证,抗辐射等级IEC 60601-1-2。

产品详细说明

1.技术架构与核心功能

光源耦合系统:

采用多层非球面反射镜组,反射效率≥99.8%(13.5nm波长)。

集成光纤准直器(数值孔径NA=0.9),实现激光与EUV光源的高效耦合。

调制控制单元:

基于MEMS微镜阵列的动态相位调制器,相位分辨率≤0.01λ(λ=13.5nm)。

数字信号处理器(DSP)实时反馈控制,闭环带宽≥50kHz。

环境适应性:

真空封装设计,内部气压<1e-6 mbar,减少气体散射干扰。

钛合金框架与碳化硅散热基板,热导率≥400W/(m·K)。

2.性能突破

光束稳定性:

长期漂移≤0.05μm/小时(24小时连续运行)。

抗干扰能力:

电磁屏蔽层采用氮化铝-铜复合结构,屏蔽效能≥100dB(1MHz~10GHz)。

能效优化:

光学转换效率≥85%,系统整体功耗≤500W。

技术规格:ASML 4022 456 10381

参数项规格描述

工作波长13.5nm(EUV)

光斑尺寸≤0.3μm(1σ)

功率范围100W~500W(连续可调)

响应时间≤500μs(功率阶跃变化)

环境温度-5℃~45℃(工作模式)

接口类型光纤接口(FC/PC)+数字控制总线(PCIe Gen4)

功耗≤500W(运行模式)

Product brief description

ASML 4022 456 10381 is a high-precision laser modulation module designed by ASML for EUV lithography machines.The core features include:

Subnanometer-level spot control:Adaptive optical shaping technology is adopted,the spot diameter is≤0.3μm(13.5nm wavelength).

Dynamic power adjustment:Supports continuous adjustable 100W~500W,and the response time is<500μs.

Clean room-level reliability:passed Class 0.1 clean room certification,radiation resistance level IEC 60601-1-2.

Product details

1.Technical architecture and core functions

Light source coupling system:

A multi-layer aspherical mirror group was used,with a reflection efficiency of≥99.8%(13.5nm wavelength).

Integrated fiber optic collimator(numerical aperture NA=0.9)to achieve efficient coupling between laser and EUV light source.

Modulation control unit:

Dynamic phase modulator based on MEMS micromirror array,phase resolution≤0.01λ(λ=13.5nm).

Digital signal processor(DSP)real-time feedback control,closed-loop bandwidth≥50kHz.

Environmental adaptability:

Vacuum package design,internal air pressure<1e-6 mbar,reducing gas scattering interference.

Titanium alloy frame and silicon carbide heat dissipation substrate,thermal conductivity≥400W/(m·K).

2.Performance breakthrough

Beam Stability:

Long-term drift≤0.05μm/hour(24-hour continuous operation).

Anti-interference ability:

The electromagnetic shielding layer adopts a aluminum nitride-copper composite structure,with a shielding effect of≥100dB(1MHz~10GHz).

Energy efficiency optimization:

Optical conversion efficiency is≥85%,and the overall power consumption of the system is≤500W.

Technical Specifications:ASML 4022 456 10381

Parameters Specification Description

Operating wavelength:13.5nm(EUV)

Spot size≤0.3μm(1σ)

Power range:100W~500W(continuously adjustable)

Response time≤500μs(power step change)

Ambient temperature-5℃~45℃(working mode)

Interface type Fiber Optical Interface(FC/PC)+Digital Control Bus(PCIe Gen4)

Power consumption≤500W(operating mode)