NI PXI-8330

-硬件级触发响应延迟<1µs(典型值)。

系统集成能力

-设备扩展:

-最多支持8个MXI-3从节点(级联配置);

-兼容NI PXIe-6363等DAQ模块构建混合系统;

-实时性:

-结合NI Linux实时控制器(如NI 9002)实现确定性通信。

技术特点

高可靠性设计:

-工业级温控芯片组(工作温度-40°C至85°C);

-光纤接口抗电磁干扰(适用于高噪声环境)。

描述

NI PXI-8330产品详细说明

产品概述

NI PXI-8330是美国国家仪器(NI)推出的高性能工业接口模块,基于PXI总线架构设计,专为复杂工控系统提供高速数据传输与多协议兼容性支持。其集成MXI-3(Multi-Protocol eXpansion Interface)接口,可扩展外部设备或子系统,适用于分布式测试、实时数据交互及跨平台通信场景。

核心参数与功能

接口与协议支持

-主接口:PXI总线(兼容PXI Express chassis);

-扩展接口:MXI-3(支持光纤/铜缆连接,传输速率可达5 Gb/s);

-协议兼容性:

-PXI星触发(Star Trigger)同步机制;

-支持IEEE 1588精确时间协议(PTP);

-兼容传统VXI仪器扩展需求。

性能指标

-带宽:

-PXI背板共享带宽(具体速率依赖chassis配置);

-MXI-3独立通道带宽:理论峰值2.5 Gb/s(实测受线缆长度影响);

-延迟:

-硬件级触发响应延迟<1µs(典型值)。

系统集成能力

-设备扩展:

-最多支持8个MXI-3从节点(级联配置);

-兼容NI PXIe-6363等DAQ模块构建混合系统;

-实时性:

-结合NI Linux实时控制器(如NI 9002)实现确定性通信。

技术特点

高可靠性设计:

-工业级温控芯片组(工作温度-40°C至85°C);

-光纤接口抗电磁干扰(适用于高噪声环境)。

灵活部署:

-模块化固件架构(支持FPGA逻辑自定义);

-通过LabVIEW FPGA模块实现协议定制。

典型应用场景

分布式测试系统:

-多站点同步测试(如风电场远程监控);

-跨机柜设备互联(如半导体制造产线)。

混合总线整合:

-PXI与传统VXI仪器共存系统(通过协议转换);

-结合EtherCAT主站实现运动控制与数据采集融合。

NI PXI-8330 Product Detailed Description

Product Overview

NI PXI-8330 is a high-performance industrial interface module launched by National Instruments(NI).It is designed based on the PXI bus architecture and is specially designed for complex industrial control systems to provide high-speed data transmission and multi-protocol compatibility support.It integrates MXI-3(Multi-Protocol eXpansion Interface)interface,which can expand external devices or subsystems,and is suitable for distributed testing,real-time data interaction and cross-platform communication scenarios.

Core parameters and functions

Interface and protocol support

-Main interface:PXI bus(compatible with PXI Express chassis);

-Extended interface:MXI-3(supports fiber/copper cable connection,transmission rate up to 5 Gb/s);

-Protocol Compatibility:

-PXI star trigger synchronization mechanism;

-Supports IEEE 1588 Precision Time Protocol(PTP);

-Compatible with traditional VXI instrument expansion requirements.

Performance metrics

-Bandwidth:

-PXI backplane shared bandwidth(specific rate depends on chassis configuration);

-MXI-3 independent channel bandwidth:theoretical peak 2.5 Gb/s(actual measurement is affected by cable length);

-Delay:

-Hardware-level trigger response delay<1µs(typical).

System integration capability

-Device extension:

-Support up to 8 MXI-3 slave nodes(cascaded configuration);

-Compatible with NI PXIe-6363 and other DAQ modules to build hybrid systems;

-Real-time:

-Consisting of NI Linux real-time controllers(such as NI 9002)to achieve deterministic communication.

Technical Features

High reliability design:

-Industrial-grade temperature control chipset(operating temperature-40°C to 85°C);

-Fiber optic interface anti-electromagnetic interference(suitable for high noise environments).

Flexible deployment:

-Modular firmware architecture(supports FPGA logic customization);

-Implement protocol customization through the LabVIEW FPGA module.

Typical application scenarios

Distributed testing system:

-Multi-site synchronous testing(such as remote monitoring of wind farms);

-Interconnection of cross-cabinet equipment(such as semiconductor manufacturing production lines).

Hybrid bus integration:

-PXI and traditional VXI instrument coexistence system(transformed through protocol);

-Combined with the EtherCAT master station to realize the integration of motion control and data acquisition.