NI PXIe-1078

-深度8.43英寸(214.床),重量16.6磅(约7.5 kg);

-低深度设计,适配机架与台式应用场景;

-散热系统:

-可选高风扇速度模式(增强散热,降低噪音);

-支持填充面板安装(维持模块冷却效率)。

兼容性

-模块支持:

-PXI Express模块(全插槽兼容);

-标准PXI模块(限混合插槽);

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描述

产品概述

NI PXIe-1078是美国国家仪器(NI)推出的高性能PXI Express机箱,采用9槽模块化设计,支持混合总线架构(PXI/PXI Express兼容),专为高精度测试测量、工业自动化及科研领域设计。其集成高速背板与同步机制,适用于复杂多通道数据采集系统。

核心参数与功能

机箱架构

-插槽数量:9个插槽(3个PXI Express专用插槽+5个混合插槽,兼容标准PXI模块);

-背板带宽:

-每插槽最高250 MB/s,系统总带宽1 GB/s;

-PXI Express插槽支持PCIe x4通道(理论速率5 GT/s)。

同步与定时

-参考时钟:10 MHz与100 MHz高精度时钟源(精度±25 ppm,槽间偏斜<100 ps);

-触发总线:PXI触发总线(支持星形触发同步机制)。

物理特性

-尺寸与重量:

-深度8.43英寸(214.床),重量16.6磅(约7.5 kg);

-低深度设计,适配机架与台式应用场景;

-散热系统:

-可选高风扇速度模式(增强散热,降低噪音);

-支持填充面板安装(维持模块冷却效率)。

兼容性

-模块支持:

-PXI Express模块(全插槽兼容);

-标准PXI模块(限混合插槽);

-协议扩展:

-兼容CompactPCI/CompactPCI Express设备。

技术特点

高密度扩展:

-9槽设计支持多类型模块混合部署(如高速数字化仪、数字化仪与开关模块共存);

工业级可靠性:

-工作温度范围0°C至50°C,总功率支持300 W;

-金属机身抗电磁干扰(EMI)。

典型应用场景

测试测量系统:

-半导体器件特性分析(多通道信号同步采集);

-振动测试(结合PXIe-6363动态信号采集模块);

工业自动化:

-生产线分布式控制(混合总线设备互联);

-车载电子测试(宽温设计适配严苛环境)。

Product Overview

The NI PXIe-1078 is a high-performance PXI Express chassis launched by National Instruments(NI).It adopts a 9-slot modular design and supports a hybrid bus architecture(PXI/PXI Express compatible).It is designed for high-precision testing and measurement,industrial automation and scientific research fields.It integrates high-speed backplane and synchronization mechanism,which is suitable for complex multi-channel data acquisition systems.

Core parameters and functions

Chassis architecture

-Number of slots:9 slots(3 PXI Express dedicated slots+5 hybrid slots,compatible with standard PXI modules);

-Backplane bandwidth:

-Up to 250 MB/s per slot,total system bandwidth is 1 GB/s;

-PXI Express slot supports PCIe x4 channels(theoretical rate 5 GT/s).

Synchronization and timing

-Reference clock:10 MHz and 100 MHz high-precision clock source(accuracy±25 ppm,slot skew<100 ps);

-Trigger bus:PXI trigger bus(supports star trigger synchronization mechanism).

Physical characteristics

-Dimensions and weight:

-8.43 inches(214.bed)and 16.6 lbs(approximately 7.5 kg);

-Low-depth design,adapted to rack and desktop application scenarios;

-Heat dissipation system:

-High fan speed mode available(enhanced heat dissipation and reduced noise);

-Supports filling panel installation(maintains module cooling efficiency).

compatibility

-Module support:

-PXI Express module(full slot compatible);

-Standard PXI module(limited to hybrid slots);

-Protocol extension:

-CompactPCI/CompactPCI Express devices.

Technical Features

High density expansion:

-The 9-slot design supports mixed deployment of multiple types of modules(such as high-speed digitizer,digitizer and switch module coexist);

Industrial-grade reliability:

-Operating temperature range 0°C to 50°C,total power supports 300 W;

-Metal body anti-electromagnetic interference(EMI).

Typical application scenarios

Test and measurement system:

-Semiconductor device characteristics analysis(multi-channel signal synchronous acquisition);

-Vibration test(combined with PXIe-6363 dynamic signal acquisition module);

Industrial automation:

-Distributed control of production line(hybrid bus equipment interconnection);

-Car electronic testing(wide temperature design adapts to harsh environments).