描述
TEB207-12 OGSI EC80-000157产品详情
一、产品概述
TEB207-12 OGSI EC80-000157是由Tokyo Electron(东京电子,简称TEL)生产的电子模块组件,主要用于半导体制造设备中,如真空蚀刻机、化学气相沉积(CVD)系统、物理气相沉积(PVD)系统以及清洗设备等。该模块作为设备内部的关键组件,负责实现特定功能,如信号调节、电源控制或接口通信等。
二、核心功能
功能定位
根据命名结构及行业经验,该模块可能属于以下功能之一:
电源控制模块:负责设备的电源供应与电压调节,确保系统稳定运行。
IO接口控制模块:管理输入输出信号,实现设备与外部系统的通信。
信号调节或驱动模块:对传感器信号进行放大、滤波或转换,提高信号质量。
应用场景
该模块通常应用于TEL的高端半导体设备中,如TEL Unity、Trias、Nexx、Trias SPA、Eagle等系列,参与以下子系统工作:
等离子源控制:调节等离子体的生成与维持,确保工艺稳定性。
腔体真空状态检测与调节:监控真空腔体的压力,确保工艺环境符合要求。
RF匹配器调节:优化射频功率的传输效率,提高工艺效果。
温控或流量监控子系统:精确控制温度或气体流量,确保工艺参数的准确性。
三、技术特性
专用定制设计
作为TEL的专用定制模块(custom modules),该产品的技术参数和设计细节通常不对外公开。
模块编号中的”EC80-xxxxx”属于TEL或OGSI的内部控制件编号,外界资料较少。
高可靠性
半导体设备对模块的稳定性和可靠性要求极高,该模块经过严格测试,能够在高温、高真空等极端环境下长期运行。
四、应用领域
半导体制造
蚀刻设备:用于等离子体蚀刻工艺,实现高精度的图案转移。
沉积设备:在CVD或PVD工艺中,控制薄膜的沉积速率和质量。
清洗设备:确保晶圆表面的清洁度,减少工艺缺陷。
其他工业领域
尽管该模块主要针对半导体设备设计,但其技术特性也可应用于其他需要高精度控制的工业领域,如平板显示制造、光伏设备等。


TEB207-12 OGSI EC80-000157 Product Details
I.Product Overview
TEB207-12 OGSI EC80-000157 is an electronic module component produced by Tokyo Electron(TEL),mainly used in semiconductor manufacturing equipment,such as vacuum etcher,chemical vapor deposition(CVD)system,physical vapor deposition(PVD)system and cleaning equipment.As a key component inside the equipment,this module is responsible for implementing specific functions,such as signal conditioning,power control or interface communication.
II.Core Functions
Function Positioning
Based on the naming structure and industry experience,this module may belong to one of the following functions:
Power control module:responsible for the power supply and voltage regulation of the equipment to ensure stable operation of the system.
IO interface control module:manages input and output signals to realize communication between the equipment and external systems.
Signal conditioning or drive module:amplifies,filters or converts sensor signals to improve signal quality.
Application scenarios
This module is usually used in TEL’s high-end semiconductor equipment,such as TEL Unity,Trias,Nexx,Trias SPA,Eagle and other series,and participates in the following subsystems:
Plasma source control:adjust the generation and maintenance of plasma to ensure process stability.
Cavity vacuum state detection and adjustment:monitor the pressure of the vacuum cavity to ensure that the process environment meets the requirements.
RF matcher adjustment:optimize the transmission efficiency of RF power and improve the process effect.
Temperature control or flow monitoring subsystem:accurately control temperature or gas flow to ensure the accuracy of process parameters.
III.Technical characteristics
Specialized custom design
As TEL’s special custom modules,the technical parameters and design details of this product are usually not disclosed to the public.
The”EC80-xxxxx”in the module number belongs to the internal control part number of TEL or OGSI,and there is little external information.
High reliability
Semiconductor equipment has extremely high requirements for the stability and reliability of the module.This module has been strictly tested and can operate for a long time in extreme environments such as high temperature and high vacuum.
IV.Application fields
Semiconductor manufacturing
Etching equipment:used in plasma etching process to achieve high-precision pattern transfer.
Deposition equipment:in CVD or PVD process,control the deposition rate and quality of thin film.
Cleaning equipment:ensure the cleanliness of wafer surface and reduce process defects.
Other industrial fields
Although this module is mainly designed for semiconductor equipment,its technical characteristics can also be applied to other industrial fields that require high-precision control,such as flat panel display manufacturing,photovoltaic equipment,etc.
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